中文雜誌館的部落格

興大工程學刊 7月號/2010 第21卷第2期強檔特價

博客來親子育樂-教育分類站長推薦

中文目錄
錫與鈷銅合金基材之界面反應 ∕郭俊毅、王朝弘
無鉛銲料錫銀鉍銦與銅電極之電遷移研究∕江昱彥、孫國浩、吳子嘉
應用於下世代微電子連接點線之奈米金屬粒子相變態行為研究∕高子軒、宋振銘、陳引幹、董騰元、黃文星
應用Norris-Landzberg加速壽命模型在球閘陣列封裝之可靠性評估∕鍾官榮
Sn-9wt%Zn無鉛銲料與金屬基材之界面反應∕劉為開、顏怡文、柴世融

英文目錄
Interfacial Reactions between Sn and Co-Cu Substrates / Chun-Yi Kuo, Chao-Hong Wang
Study of Electromigration on Lead-Free Tin-Silver-Bismuth-Indium Solder with Cu Electrodes / Yu-Yen Chiang, Kuo-Hao Sun, Albert T. Wu
Phase Transformation of Metallic Nanoparticles for Next Generation Microelectronic Interconnections / Tzu-Hsuan Kao, Jenn-Ming Song, In-Gann Chen, Teng-Yuan Dong, Weng-Sing Hwang
Reliability Assessment of Ball Grid Array Packages Using Norris-Landzberg Acceleration Model / Kuan-Jung Chung
Interfacial Reactions between Sn-9wt%Zn Lead-Free Solder and Metallic Substrates / Wei-Kai Liou, Yee-Wen Yen, Shih-Jung Chai